Device for electrical connection of an integrated circuit chip
US7888791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Aug 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.