Temperature control of micromachined transducers
US7888844B2 · kind B2 · utility
2Cited by
14References
13Claims
0Family size
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Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Sep 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.