Substrate splitting apparatus and a method for splitting a substrate
US7888899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | May 15, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7805
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A substrate splitting apparatus and a method for splitting a substrate using the substrate splitting apparatus are provided. The substrate splitting apparatus includes a servo motor, a transmission device, a substrate breaking bar, and a stage. One end of the transmission is directly or indirectly coupled to the servo motor while the other end is coupled with the breaking bar. The stage has a load-lock surface and the load-lock surface faces the breaking bar. The servo motor drives the transmission device to move the breaking bar toward the load-lock surface. A substrate with a pre-crack on the bottom is disposed on the load-lock surface. The servo motor drives the substrate breaking bar to move towards or away from the pre-crack. The method of splitting includes the following steps: forming a pre-crack on the substrate; controlling the servo motor to drive the breaking bar to move towards the substrate; and controlling the breaking bar to press the substrate at the pre-crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.