Patent · US Active

Current test probe having a solder guide portion, and related probe assembly and production method

US7888958B2 · kind B2 · utility

18Cited by

1References

13Claims

0Family size

Assignee

Kabushiki Kaisha Nihon Micronics · JP

Inventors

Akira Souma · Tokyo, JP
Yoshikazu Urushiyama · Dresden, DE
Masahisa Tazawa · Aomori, JP
Tomoya Sato · Kawasaki, JP
Hideki Hirakawa · Kawasaki, JP
Takayuki Hayashizaki · Aomori, JP

Key dates

Filing date	Jan 25, 2006
Grant date	Feb 15, 2011
Priority date	—
Expiry date	Dec 19, 2026

Classification

Technology area (CPC G)Physics
CPC primaryG01R3/00
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.