Heat spreading circuit assembly
US7889502B1 · kind B1 · utility
27Cited by
45References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2005 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Aug 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.