Method for quantifying hole flow rates in film cooled parts
US7890274B2 · kind B2 · utility
5Cited by
10References
19Claims
0Family size
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Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Mar 30, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2300/5024
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring a flow rate through a cooling hole of a film cooled part includes the steps of 1) measuring a transient thermal response of an internal surface temperature corresponding solely to an inside portion of a cooling hole for a film cooled part resulting from a flow of fluid through the part, the fluid having an initial temperature that is different from an initial temperature of the film cooled part, 2) mathematically characterizing the transient thermal response, and 3) determining the cooling hole flow rate from the mathematical characterization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.