Sensor-based feedback method for improved assembly of vacuum electronic devices
US7891078B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Aug 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of improving efficiency of manufacturing a vacuum electronic device, includes placing sensors on the device's interior during its construction and obtaining a first measured characteristic value; comparing the first measured characteristic value with a desired characteristic value; determining whether the first measured characteristic value is within a predetermined percentage of the desired characteristic value; adjusting a component of the device and measuring the characteristic of the device to obtain a second measured characteristic, comparing the second measured characteristic value with a desired characteristic value, determining whether the second measured characteristic value is within a predetermined percentage of the desired characteristic value; and repeating the previous step until the second measured characteristic value is within the predetermined percentage of the desired characteristic value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.