Mold assembly device and method for assembling a semi-permanent mold assembly
US7891402B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2007 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Dec 18, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22C9/108
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold assembly device and method for assembling a semi-permanent mold assembly is disclosed, the mold assembly device includes a base die and a transfer frame, wherein the transfer frame is capable of transferring a core package to the base die and facilitates assembly of the transfer frame and the core package with the base die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.