Method for manufacturing heat dissipator having heat pipes and product of the same
US7891414B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Dec 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.