Monitoring or imaging system with interconnect structure for large area sensor array
US7892176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2007 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jul 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.