Manufacturing process of embedded type flexible or rigid printed circuit board
US7892412B2 · kind B2 · utility
1Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Dec 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the copper foil according to the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic layer and the organic layer is solidified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.