Liquid crystalline polymer composition and molded article made of the same
US7892450B2 · kind B2 · utility
28Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2323/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a liquid crystalline polymer composition comprising: 100 parts by weight of a LCP, and equal to or more than 0.01 and less than 1 part by weight of a low temperature softening inorganic glass filler whose softening temperature is equal to or less than 550° C. The composition can provide a molded article which cause no or less blister formation upon reflow soldering using a lead-free solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.