Microscapsule powder
US7892644B2 · kind B2 · utility
3Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2006 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Aug 1, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2989
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention relates to a microcapsular powder having a latent heat storage material as a capsule core and a capsule wall constructed of
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.