LED packaging method using a screen plate
US7892868B2 · kind B2 · utility
1Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jul 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
Abstract
A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.