Laser micromachining and methods of same
US7893386B2 · kind B2 · utility
1Cited by
33References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Oct 19, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/146
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.