Semiconductor photodiode and method of manufacture thereof
US7893464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Feb 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/544
Abstract
A method of manufacture of an avalanche photodiode involving a step of making a recess in a top window layer of an avalanche photodiode layer stack, such that a wall surrounding the recess runs smoothly and gradually from the level of the recess to the level of the window layer. Further, diffusing a dopant over the entire window layer area so as to form a p-n junction at the bottom of the recess, and providing a first electrical isolation region around the recess by buried ion implantation or wet oxidation in order to limit the flow of electrical current to the p-n junction. Forming an isolation trench around the photodiode and a second electrical isolation region by ion implantation into the trench such that the second electrical isolation region runs through the absorption layer of the photodiode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.