Semiconductor apparatus and mobile apparatus
US7893539B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Dec 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes: a wiring board; a first semiconductor device mounted on the wiring board; a second semiconductor device which is stacked on the first semiconductor device and a projection part projects from the outer edge of the first semiconductor device; and a sealing resin layer which seals each semiconductor device. And the second semiconductor device has thereon a first analog cell, and a second analog cell which reaches a higher temperature than the first analog cell, and the second analog cell is arranged so as to include the projection part of the second semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.