Circuit die to circuit die interface system
US7893717B1 · kind B1 · utility
9Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Dec 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/4902
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A circuit die to circuit die interface system includes a first circuit die with a first circuit having a first default signal, at least a second circuit die with a second circuit having a second default signal; and a logic circuit disposed on one of the first and second circuit dies and enabled by a default signal from all but one of the circuits to transmit a communication signal from the remaining circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.