Multi-chip package semiconductor device
US7893757B2 · kind B2 · utility
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5References
10Claims
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Key dates
| Filing date | Nov 26, 2007 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Nov 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.