Pattern shaping of RF emission patterns
US7893882B2 · kind B2 · utility
47Cited by
78References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jul 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/26
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A metallic shaping plate located in the interior housing of a wireless device is disclosed. The metallic shaping plate may influence a radiation pattern being generated by a horizontal antenna array. The result may be an increase in the gain of the array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.