Disposing structure for hot swappable motherboard in industrial computer chassis
US7894195B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2009 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Oct 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1487
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A disposing structure of industrial computer chassis includes a chassis shell, two motherboard trays and a back plate. The interior of the chassis shell is divided into a storage unit section and a motherboard section. The interior of the storage unit section is arranged at least one storage unit, while two motherboard trays are disposed in the motherboard section. The interior of each motherboard tray is arranged a motherboard. In the motherboard trays, at least one motherboard tray is extended a wedge frame toward the storage unit section. A transfer card having a hot swapping function is arranged on the wedge frame and is arranged by inserting into the corresponding motherboard. In addition, a back plate is arranged between the storage unit section and the motherboard section. Corresponding to the wedge frame, a slot capable of a hot swapping function is arranged on the back plate. In so doing, the transfer card may be inserted into the slot, thereby, providing a hot swapping function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.