Methods of fabricating a membrane with improved mechanical integrity
US7895720B2 · kind B2 · utility
1Cited by
80References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2008 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Aug 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Methods for fabricating robust films across a patterned underlying layer's edges or steps are disclosed. The novel methods diminish the negative effects of electrode steps or edges on the integrity of a membrane. Thus, the methods are particularly applicable to membrane release technology. The height of the step or edge is eliminated or reduced to increase the mechanical integrity of the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.