Patent · US Expired

Apparatus for applying semiconductor chip to substrates comprising a moveable curing device and method of use thereof

US7895739B2 · kind B2 · utility

10Cited by

4References

14Claims

0Family size

Inventors

Sigmund Niklas · Monsheim, DE
Ewald Weckerle · Wenzenbach, DE
Uwe Timm · Birkenfeld, DE

Key dates

Filing date	Sep 27, 2003
Grant date	Mar 1, 2011
Priority date	—
Expiry date	Jul 19, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1798
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a device and a method for applying semiconductor chips (5) to a plurality of carriers (4), especially smart card modules or flexboards. According to the invention, an adhesive application device (1) is used to apply an adhesive to pre-defined positions on the carrier (4), a fitting device (2) is used to apply the semiconductor chips (5) to the positions on the carrier (4), and a hardening device (3) is used to harden the adhesive. The hardening device (3) and/or another device can be connected to a conveyor belt (6) for transporting the carrier (4) along the devices, by means of a clamping device (13, 14), and can be displaced in the transport direction at the speed of the conveyor belt (6), by means of a lifting device (15).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.