Method for manufacturing a heat pipe with a planished end surface
US7895747B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Aug 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49368
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted into the pipe body. By use of the male mold, the sealed end of the pipe body with respect to the female mold is stamped to form a planished surface at the sealed end of the pipe body. Whereby after the heat pipe is finished, an electronic device is capable of being mounted on the planished surface at the sealed end of the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.