Method and apparatus for forming outer electrode of electronic component
US7895969B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Dec 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat board 1 having an area being a plurality of times as large as that of a holding plate in a longitudinal direction of the flat board. A paste film is spread on the flat board by moving the flat board 1 by a length corresponding to the length of one holding plate while a predetermined gap is maintained between the squeegee blade and the flat board. The electrode paste is applied to first end surfaces of electronic components C held by the holding plate H by dipping the first end surfaces of the electronic components C in this paste film. The electrode paste is applied to the first end surfaces of the electronic components a plurality of times by repeating the spreading step and the applying step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.