Integral bonding attachment
US7896712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2006 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Nov 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/932
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.