Semiconductor substrate cleaning liquid and semiconductor substrate cleaning process
US7896970B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 16, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Aug 30, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorganic acid; and water. There is also provided a process for cleaning a semiconductor substrate that includes a first step of cleaning the semiconductor substrate using the semiconductor substrate cleaning liquid composition and, subsequent to the first step, a second step of cleaning the semiconductor substrate with pure water, ozone water formed by dissolving ozone gas in pure water, or aqueous hydrogen peroxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.