Flooring panels
US7897005B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2005 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jan 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/7045
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of connecting structural components having a relatively low thickness, the method including pre-applying, at an off-site location, one of an adhesive and a substance which activates an adhesive to at least one of at least one of the sides of the groove of one of the structural components and at least one of the sides of the tongue of another of the structural components, and connecting, at a site different from the off-site location, the structural components together by causing the tongue to be inserted into the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.