Patent · US Active

Flooring panels

US7897005B2 · kind B2 · utility

18Cited by
28References
45Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 20, 2005
Grant dateMar 1, 2011
Priority date
Expiry dateJan 16, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T403/7045
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A method of connecting structural components having a relatively low thickness, the method including pre-applying, at an off-site location, one of an adhesive and a substance which activates an adhesive to at least one of at least one of the sides of the groove of one of the structural components and at least one of the sides of the tongue of another of the structural components, and connecting, at a site different from the off-site location, the structural components together by causing the tongue to be inserted into the groove.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.