Patent · US Active

Microreactor assembly incorporating interconnect backbone

US7897114B2 · kind B2 · utility

13Cited by
9References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 22, 2008
Grant dateMar 1, 2011
Priority date
Expiry dateSep 9, 2029

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/32
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A microreactor assembly comprising a fluidic interconnect backbone and plurality of fluidic microstructures is provided. The fluidic microstructures are supported by respective portions of the fluidic interconnect backbone, The microreactor assembly comprises a plurality of non-polymeric interconnect seals associated with the interconnect input and output ports. The interconnect input port of the fluidic interconnect backbone is interfaced with the microchannel output port of a first fluidic microstructure at one of the non-polymeric interconnect seals. The interconnect output port of the fluidic interconnect backbone is interfaced with the microchannel input port of a second fluidic microstructure at another of the non-polymeric interconnect seals. The interconnect microchannel is defined entirely by the fluidic interconnect backbone and is configured such that it extends from the non-polymeric interconnect seal at the microchannel output port of the first fluidic microstructure to the non-polymeric interconnect seal at the microchannel input port of the second fluidic microstructure without interruption by additional sealed interfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.