Bonded structure
US7897245B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 15, 2009 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jun 15, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.