Inducement of strain in a semiconductor layer
US7897493B2 · kind B2 · utility
7Cited by
25References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jun 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Strain is induced in a semiconductor layer. Embodiments include inducing strain by, for example, creation of free surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.