Inductance-tuned circuit board via crosstalk structures
US7897880B1 · kind B1 · utility
49Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jun 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Plated through holes pass through clearances in a ground plane of a circuit board. A conductive collar/spoke arrangement is constructed on the ground plane adjacent the clearance, to provide an inductive component to the coupling between a plated through hole and the ground plane. The inductive component impedes the transfer of high-frequency noise between the through hole and the ground plane. Other embodiments are also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.