Component with a semiconductor junction and method for the production thereof
US7898052B2 · kind B2 · utility
10Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Dec 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/199
Abstract
A component comprising a semiconductor junction (HU) is proposed which is formed from crystalline doped semiconductor layers. A semiconductor circuit (IC) is formed on the surface of the component, and a diode is formed internally and directly below the circuit. Integrated circuit and diode are connected to one another and formed and integrated diode component, in particular a photodiode array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.