Apparatus and method for housing micromechanical systems
US7898071B2 · kind B2 · utility
3Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2008 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Feb 13, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.