Patent · US Active

Apparatus and method for housing micromechanical systems

US7898071B2 · kind B2 · utility

3Cited by
6References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 9, 2008
Grant dateMar 1, 2011
Priority date
Expiry dateFeb 13, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2203/0118
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.