Electronic devices including flexible electrical circuits and related methods
US7898074B2 · kind B2 · utility
13Cited by
11References
19Claims
0Family size
Inventors
Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Dec 12, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.