Nanotube materials for thermal management of electronic components
US7898079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Nov 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-conducting medium may also include an upper surface against which a heat source may be placed, an opposing lower surface and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed. The heat-conducting medium may also include a pad placed on the upper surface to provide structural support to the member. A method for manufacturing the heat-conducting medium is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.