Variably orientated capacitive elements for printed circuit boards and method of manufacturing same
US7898818B2 · kind B2 · utility
4Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 7, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Oct 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Variably oriented capacitive elements for printed circuit boards (PCBs) and method of manufacturing the same. In one form the disclosure, a PCB can include a first multiple-layered capacitor including a first orientation and placed along a surface operable to mount electronic components. The PCB can also include a second multiple-layered capacitor including a second orientation different from the first. The second multiple-layered capacitor can be placed along the surface near the first multiple-layered capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.