Layer 2/layer 3 interworking via internal virtual UNI
US7899062B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2008 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L49/25
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A multi service platform having multiple layer switching includes a layer two switching component disposed within an enclosure of the multi service platform. A layer three switching component is disposed within and integrated together with the layer two switching component within the enclosure of the multi service platform. A connection, including an internal virtual UNI connection, terminates at the layer two switching component and at the layer three switching component. The connection is disposed internally within the multi service platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.