Method and apparatus for bonding and debonding adhesive interface surfaces
US7901532B2 · kind B2 · utility
17Cited by
3References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | May 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1956
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a system and a method of improving the debonding of two or more surfaces together. The invention utilises thermoexpanadable microspheres and thermal energy to debond interfaces in an adhesive system or as vehicle carriers. It also discloses a method of curing the adhesive system prior to the debonding step so that the same adhesive system may be used for both phases. It is especially useful in the automotive industry for end of vehicle life dismantling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.