Resonating conductive traces and methods of using same for bonding components
US7901536B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | May 29, 2007 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Nov 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/102
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.