Structures for dense, crack free thin films

US7901837B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Craig P. Jacobson · Lafayette, US
• Steven J. Visco · Berkeley, US
• Lutgard C. De Jonghe · Lafayette, US

Key dates

• Filing date: Dec 5, 2006
• Grant date: Mar 8, 2011
• Expiry date: Jul 4, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.