Passivation layer for a circuit device and method of manufacture
US7902083B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2010 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Jan 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.