Thermal paper
US7902117B2 · kind B2 · utility
2Cited by
21References
11Claims
0Family size
Inventors
Key dates
| Filing date | Dec 1, 2005 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Dec 1, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/426
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a thermal paper composite precursor comprising (a) a substrate layer; and (b) a base layer positioned on the substrate layer, the base layer comprising a binder and at least one porosity improver wherein the thermal paper composite precursor has a thermal effusivity that is at least about 2% less than the thermal effusivity of porosity improver-less thermal paper composite precursor. The thermal paper composite precursor is useful in making thermal paper composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.