Heat sink arrangement for electrical apparatus
US7902464B2 · kind B2 · utility
1Cited by
9References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2009 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.