Method of manufacturing sealed electronic component and sealed electronic component
US7902481B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Jul 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H3/02
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.