Patent · US Active

Laser machining apparatus and laser machining method

US7902483B2 · kind B2 · utility

5Cited by

15References

26Claims

0Family size

Assignee

SAUER GmbH · US

Inventors

Alfons Eiterer · Marktoberdorf, DE
Peter Hildebrand · Pfronten, DE
Michael Kuhl · Hafenhofen, DE
Martin Reisacher · Kempten, DE

Key dates

Filing date	Nov 10, 2004
Grant date	Mar 8, 2011
Priority date	—
Expiry date	Dec 30, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/0604
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.