Conductive connecting pin and package substrate
US7902659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2009 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Jan 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.