Coupling system and method for attaching thermal components in association with a board-mounted integrated circuit
US7903413B1 · kind B1 · utility
0Cited by
7References
24Claims
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Key dates
| Filing date | Jun 28, 2007 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Nov 13, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.