Method for manufacturing electronic components
US7905012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2008 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Mar 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.