Elasticated materials having bonding patterns used with low load force elastics and stiff carrier materials
US7905871B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Apr 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/643
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
This invention relates to an elasticated materials comprising a stiff carrier material that is satisfactorily elasticated with one or more elastic strands with a low load force, due to the use of a specific bonding pattern, with specific bonding areas. The bonding areas are typically separate bonding areas positioned on separate intervals along the length direction of the carrier material, whereby each bonding area comprises one or more separate bonding zones, extending in the width (X) direction.The invention also relates to absorbent articles comprising this elasticated material and processes for making the elasticated material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.